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REVISTA DE CHIMIE
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https://doi.org/10.37358/Rev.Chim.1949

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Revista de Chimie (Rev. Chim.), Year 2016, Volume 67, Issue 6,





MIHAI BRANZEI, IOANA ARINA GHERGHESCU, SORIN CIUCA
Solder Joints Quality Assessment as Function of VPS Process Parameters

Abstract:

The challenges for the companies involved in conception, development and/or manufacturing of electronic products are the lead-free technology with its increased melting temperature of the solder alloy and trend to reduce the solder materials cost by usage of lead-free solder pastes with low or no silver content. Defining the elements *Pad-Paste-Pin-Process* as Key Process Input Variables (KPIV) in terms of *4P Soldering Model* concept, the solder joints are the result of KPIV synergistically interactions and correlations, with consequences over their microstructure. In the paper, taking into consideration the cooling rate influence over intermetallic compounds formation and microstructure, the investigations over electrical and mechanical properties of solder joints resulted from Vapour Phase Soldering (VPS) process in terms of 4P Soldering Model are presented. Maintaining the pad and pin elements of KPIV as references, the solder joints properties determined by low silver content pastes usage as function of cooling rate parameters of VPS process were studied. The results of the studies performed and presented in the paper will be used for improving process control in order to minimize losses on VPS lines, to reduce defects numbers and re-work time. Keywords: Shape memory alloy (SMA), Phase transformation temperature, NiTi precipitates, Differential scanning calorimetry (DSC)

Issue: 2016, Volume 67, Issue 6
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