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REVISTA DE CHIMIE
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https://doi.org/10.37358/Rev.Chim.1949

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Revista de Chimie (Rev. Chim.), Year 2003, Volume 54, Issue 8,





Role of Thiourea Additive in the Electrodeposition Process of Nanocrystalline Nickel and Iron Thin Films
Nicolae Sulitanu, Ion Sandu, Ioan-Gabriel Sandu


Abstract:

The paper deals with the process of sulphur incorporation in thin films of nikel and iron obtained by electrolysis in baths containing thiourea (TH) as an additive. There were determined the sulphur and metal (Ni, Fe respectively) concentrations, the sulphur incorporation rate and the deposit rates of metals. The process of sulphur incorporation in thin films of Ni and Fe may be regarded as a sum of the following processes: (1) the transfer of TH molecules by diffusion from the bulk of solution to the cathode; (2) the adsorption of TH molecules at the cathode; (3) the presumable TH molecules reaction with the metal ions at the cathode; (4) the detachment of organic fragments produced by TH reaction at the cathode surface and their transfer to the bulk of solution. The presence of thiourea as additive in the electrolysis bath narmally leads to a decrease in crystalline grain size. On the other hand, the sulphur atoms incorporation in the film could induce the lattice expansion and a high degree of film texture. The sulphure atoms may be incorporated in a metallic cluster at the crystallites interface similar to grain boundaries. Keywords: nanocrystalline materials; nickel-sulphur, iron-sulphur alloys, thin films, electrodeposition rate

Issue: 2003, Volume 54, Issue 8
Pages:
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